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專利授權區
專利名稱(中) 輻射散熱基板、含其之輻射冷卻裝置及其製備方法
專利名稱(英) RADIATION HEAT DISSIPATION SUBSTRATE, RADIATION COOLING DEVICE CONTAINING THE SAME AND PREPARATION METHOD THEREOF
專利家族 中華民國:I866594
專利權人 國立清華大學 100.00%
發明人 陳玉彬,姜智展,張瑞永,劉承揚,劉建豪
技術領域 材料化工,能源科技
專利摘要(中)
提供一種輻射散熱基板,其依序由寬頻輻射吸收層、金屬基板以及波長選擇性紅外光放射層所組成。再提供上述輻射散熱基板的製備方法,僅需將金屬基板放入電泳槽中,在金屬基板兩側分別沉積寬頻輻射吸收層和波長選擇性紅外光放射層即得。還提供一種輻射冷卻裝置,包含上述輻射散熱基板。
專利摘要(英)
Provided is a radiation cooling substrate, sequentially composed of a broadband radiation absorption layer, a metal substrate, and a wavelength-selective infrared emission layer. Also provided is a method for preparing the aforementioned radiation cooling substrate, which simply involves placing the metal substrate into an electrophoresis tank and depositing the broadband radiation absorption layer and the wavelength-selective infrared emission layer on the two sides of the metal substrate, respectively. Additionally, a radiation cooling device is provided, comprising the above-mentioned radiation cooling substrate.
聯絡資訊
承辦人姓名 劉千綺
承辦人電話 03-571-5131 #31181
承辦人Email chienchi@mx.nthu.edu.tw
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