A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a set of heat pipes and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The set of heat pipes is adapted for thermal coupling to the heat source, the heat from the heat source is simultaneously conducted to the vapor chamber and the set of heat pipes. The vapor chamber is thermally coupled to the heat dissipation fin set, and the set of heat pipes penetrates the heat dissipation fin set. |