| Provided is a manufacturing method of a sensor including the following steps.  A mold having a cavity is provided.  At least one chip is disposed in the cavity.  The chip has an active surface and a back surface opposite to each other.  The active surface faces toward a bottom surface of the cavity.  A polymer material is filled in the cavity to cover the back surface of the chip.  A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate.  A mold release process is performed to isolate the polymer substrate from the cavity.  A plurality of the conductive lines are formed on a first surface of the polymer substrate.  The conductive lines are electrically connected with the chip. |