Provided is a semiconductor power device including a substrate, a buffer layer, a nitride channel layer, a barrier layer, a power transistor and a complementary logic circuit. The substrate has a circuit region and a power device region. The buffer layer is disposed on the substrate. The nitride channel layer is disposed on the buffer layer. The barrier layer is disposed on the nitride channel layer. The power transistor is disposed on the substrate in the power device region. The complementary logic circuit is disposed on the substrate in the circuit region and is electrically connected to the power transistor. The complementary logic circuit includes a P-type transistor and an N-type transistor. The P-type transistor includes a two-dimensional material channel layer. The N-type transistor is electrically connected to the P-type transistor. A two-dimensional electron gas (2DEG) is located in the nitride channel layer adjacent to the interface between the nitride channel layer and the barrier layer. |