專利授權區國立清華大學國際產學營運總中心 Operations Center for Industry Collaboration

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專利授權區

專利授權區
專利名稱(中)	電子電路的製造方法以及金屬離子溶液
專利名稱(英)	METHOD OF FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION
專利家族	中華民國：I842105 美國：US-2023-0413449-A1(公開號)
專利權人	國立清華大學 100% ,國立清華大學 100%
發明人	李明蒼,陳玉彬,史瓦米
技術領域	材料化工,電子電機

專利摘要(英)
Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper （II） ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form a plurality of copper conductive patterns.

專利摘要(英)

Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper （II） ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form a plurality of copper conductive patterns.

聯絡資訊
承辦人姓名	劉千綺
承辦人電話	03-571-5131 #31181
承辦人Email	chienchi@mx.nthu.edu.tw