專利授權區國立清華大學國際產學營運總中心 Operations Center for Industry Collaboration

搜尋專利授權區

關鍵字

» 新增關鍵字

選單

專利授權區

專利授權區
專利名稱(中)	擴散阻障結構、導電疊層及其製法
專利名稱(英)	CONDUCTIVE LAMINATE AND METHOD FOR MANUFACTURING THE SAME
專利家族	美國：11,745,469 B2
專利權人	國立清華大學 100%
發明人	王偉彥,衛子健
技術領域	材料化工,能源科技,電子電機

專利摘要(英)
A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

專利摘要(英)

A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

聯絡資訊
承辦人姓名	李佳玲
承辦人電話	03-5715131 #62300
承辦人Email	cl.lee@mx.nthu.edu.tw