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專利授權區

專利授權區
專利名稱(中)	樣品分離用晶片、樣品檢測裝置及樣品檢測方法
專利名稱(英)	CHIP FOR SAMPLE SEPARATION, SAMPLE DETECTION DEVICE AND SAMPLE DETECTION METHOD
專利家族	中華民國：I807273 大陸：CN 115078050 A(公開號) 美國：US-2022-0291090-A1(公開號)
專利權人	國立清華大學 100%
發明人	曾繁根,陳冠宏
技術領域	材料化工,生化醫藥

專利摘要(英)
A chip for sample separation including a first substrate, a first electrode, a first dielectric layer, a second substrate, a second electrode, a second dielectric layer, and a flow channel layer is provided. The first electrode is disposed on the first substrate. The first dielectric layer is disposed on the first electrode and includes a first opening. The first opening exposes a portion of the first electrode. The second electrode is disposed on the second substrate. The second dielectric layer is disposed on the second electrode and includes a second opening. The second opening exposes a portion of the second electrode. An area of the first electrode exposed by the first opening is smaller than an area of the second electrode exposed by the second opening. The flow channel layer is sandwiched between the first dielectric layer and the second dielectric layer and includes a through hole. The through hole communicates between the first opening and the second opening.

專利摘要(英)

A chip for sample separation including a first substrate, a first electrode, a first dielectric layer, a second substrate, a second electrode, a second dielectric layer, and a flow channel layer is provided. The first electrode is disposed on the first substrate. The first dielectric layer is disposed on the first electrode and includes a first opening. The first opening exposes a portion of the first electrode. The second electrode is disposed on the second substrate. The second dielectric layer is disposed on the second electrode and includes a second opening. The second opening exposes a portion of the second electrode. An area of the first electrode exposed by the first opening is smaller than an area of the second electrode exposed by the second opening. The flow channel layer is sandwiched between the first dielectric layer and the second dielectric layer and includes a through hole. The through hole communicates between the first opening and the second opening.

聯絡資訊
承辦人姓名	楊美茹
承辦人電話	03-5715131 #62305
承辦人Email	mjyang2@mx.nthu.edu.tw