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專利授權區
專利名稱(中) 自吸附觸媒組成物、自吸附觸媒組成物的製造方法以及無電鍍基板的製造方法
專利名稱(英) METHOD FOR MANUFACTURING ELECTROLESS PLATING SUBSTRATE AND METHOD FOR FORMING METAL LAYER ON SURFACE OF SUBSTRATE
專利家族 美國:20210046455(公開號)
專利權人 國立清華大學 100%
發明人 高育祥,衛子健
技術領域 材料化工,能源科技
專利摘要(英)
The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.
聯絡資訊
承辦人姓名 呂建潁
承辦人電話 03-5715131 #31061
承辦人Email chienying_lu@mx.nthu.edu.tw
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