專利授權區國立清華大學國際產學營運總中心 Operations Center for Industry Collaboration

搜尋專利授權區

關鍵字

» 新增關鍵字

選單

專利授權區

專利授權區
專利名稱(中)	系統級封裝方法
專利名稱(英)	Systematic Packaging Method
專利家族	中華民國：I484569 美國：8,721,900
專利權人	國立清華大學 100.00%
發明人	方維倫,溫榮弘
技術領域	材料化工,電子電機,機械結構

專利摘要(中)
一種系統級封裝方法，該系統級封裝方法為：在封裝體上以物理性、化學性沉積及選擇性蝕刻方式，鋪鍍上單層、多層導電膜作為導電體。由於其是以單一材料構成的質量塊，達成具效能可調適性的系統單晶片多自由度慣性感測元件，故能有效提升慣性感測元件的設計彈性，降低製造成本，適用範圍廣，實用性強。

專利摘要(中)

一種系統級封裝方法，該系統級封裝方法為：在封裝體上以物理性、化學性沉積及選擇性蝕刻方式，鋪鍍上單層、多層導電膜作為導電體。由於其是以單一材料構成的質量塊，達成具效能可調適性的系統單晶片多自由度慣性感測元件，故能有效提升慣性感測元件的設計彈性，降低製造成本，適用範圍廣，實用性強。

專利摘要(英)
A system in package method, the method includes: with physical property, chemistry nature deposit and selectivity etching mode on packaging body, spreads and plates individual layer, multiply conductive film as electric conductor. Because it is with the quality piece of homogenous material component, reaches many degrees of freedom of SOC inertia sensing subassembly of an efficiency nature adjusted, so can effectively promote the design elasticity of inertia sensing subassembly, reduce the manufacturing cost, the scope of application is wide, and the practicality is strong.

專利摘要(英)

A system in package method, the method includes: with physical property, chemistry nature deposit and selectivity etching mode on packaging body, spreads and plates individual layer, multiply conductive film as electric conductor. Because it is with the quality piece of homogenous material component, reaches many degrees of freedom of SOC inertia sensing subassembly of an efficiency nature adjusted, so can effectively promote the design elasticity of inertia sensing subassembly, reduce the manufacturing cost, the scope of application is wide, and the practicality is strong.

聯絡資訊
承辦人姓名	楊慧敏
承辦人電話	(03)571-5131 #31181
承辦人Email	hmyang@mx.nthu.edu.tw