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專利授權區

專利授權區
專利名稱(中)	擴散阻障結構、導電疊層及其製法
專利名稱(英)	DIFFUSION BARRIER STRUCTURE, AND CONDUCTIVE LAMINATE AND MANUFACTURING METHOD THEREOF
專利家族	中華民國：I669209 大陸：4528006 美國：11,331,883
專利權人	國立清華大學 100%
發明人	王偉彥,衛子健
技術領域	材料化工,能源科技,電子電機

專利摘要(英)
A diffusion barrier structure, and a conductive laminate and a manufacturing method thereof are provided. The conductive laminate includes a substrate, a diffusion barrier structure, and a conductive layer. The diffusion barrier structure is formed between the substrate and the conductive layer. The diffusion barrier structure includes a discontinuous modifying layer and a barrier layer. The discontinuous modifying layer is disposed on the substrate. A material for composing the discontinuous modifying layer is a polymer with hydrophilic group. The barrier layer is disposed on the substrate and the discontinuous modifying layer. A material for composing the barrier layer includes at least one self-healing polymer.

專利摘要(英)

A diffusion barrier structure, and a conductive laminate and a manufacturing method thereof are provided. The conductive laminate includes a substrate, a diffusion barrier structure, and a conductive layer. The diffusion barrier structure is formed between the substrate and the conductive layer. The diffusion barrier structure includes a discontinuous modifying layer and a barrier layer. The discontinuous modifying layer is disposed on the substrate. A material for composing the discontinuous modifying layer is a polymer with hydrophilic group. The barrier layer is disposed on the substrate and the discontinuous modifying layer. A material for composing the barrier layer includes at least one self-healing polymer.

聯絡資訊
承辦人姓名	李佳玲
承辦人電話	03-5715131 #62300
承辦人Email	cl.lee@mx.nthu.edu.tw