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專利授權區

專利授權區
專利名稱(中)	全無機上轉換顯示器
專利名稱(英)	All-inorganic upcoversion display
專利家族	中華民國：I852561
專利權人	國立清華大學 100% ,國立清華大學 100%
發明人	吳孟奇
技術領域	通信傳輸,光電光學

專利摘要(英)
This invention provides an all-inorganic upconversion display, which comprises an array of photodiodes and an array of light emitting diodes. Said array of photodiodes includes a substrate containing first electrical conductivity carriers therein, a buffer layer formed on a first surface of said substrate, an absorption layer formed on said buffer layer, a cap layer formed on said absorption layer, a patterned passivation layer formed on said cap layer and exposed an array of contact regions of said cap layer, a common electrode formed on a second surface opposite to said first surface of said substrate, an array of electrodes connect with corresponding one of said array of contact regions, and an array of solder bumps connect with corresponding one of said array of said electrodes. Said common electrode of said array of said of photodiodes exhibits the first electrical conductivity. Each of said contact regions of said cap layer contains second electrical conductivity carriers opposite to the first electrical conductivity carriers. Said array of said light emitting diodes includes a substrate, an array of luminescent chip, a common electrode, a patterned passivation layer, and an array of solder bumps. Each of said luminescent chip has a first layer formed over said substrate of said array of said light emitting diodes and containing the first electrical conductivity carriers therein, a second layer formed over the corresponding one of said first layer and containing second electrical conductivity carriers therein, an active layer sandwiched between the corresponding one of said first layer and second layer, and an pixel electrode coupled electrically to the corresponding one of said second layer and exhibiting the second electrical conductivity. Said first layers of said luminescent chips connect each other. Said common electrode of said array of light emitting diodes exhibits the first electrical conductivity and disposed on said first layer for surrounding the corresponding one of said active layer. Said patterned passivation layer of said array of light emitting diodes covers said luminescent chips and said common electrode, and exposed said pixel electrodes and an end of said common electrode. Each of said solder bumps of said array of said light emitting diode connect with corresponding one of said pixel electrode. In this invention, each of said solder bumps of said array of photodiodes is flip chip bonded on the corresponding one of said solder bumps of said array of said light emitting diodes.

專利摘要(英)

This invention provides an all-inorganic upconversion display, which comprises an array of photodiodes and an array of light emitting diodes. Said array of photodiodes includes a substrate containing first electrical conductivity carriers therein, a buffer layer formed on a first surface of said substrate, an absorption layer formed on said buffer layer, a cap layer formed on said absorption layer, a patterned passivation layer formed on said cap layer and exposed an array of contact regions of said cap layer, a common electrode formed on a second surface opposite to said first surface of said substrate, an array of electrodes connect with corresponding one of said array of contact regions, and an array of solder bumps connect with corresponding one of said array of said electrodes. Said common electrode of said array of said of photodiodes exhibits the first electrical conductivity. Each of said contact regions of said cap layer contains second electrical conductivity carriers opposite to the first electrical conductivity carriers. Said array of said light emitting diodes includes a substrate, an array of luminescent chip, a common electrode, a patterned passivation layer, and an array of solder bumps. Each of said luminescent chip has a first layer formed over said substrate of said array of said light emitting diodes and containing the first electrical conductivity carriers therein, a second layer formed over the corresponding one of said first layer and containing second electrical conductivity carriers therein, an active layer sandwiched between the corresponding one of said first layer and second layer, and an pixel electrode coupled electrically to the corresponding one of said second layer and exhibiting the second electrical conductivity. Said first layers of said luminescent chips connect each other. Said common electrode of said array of light emitting diodes exhibits the first electrical conductivity and disposed on said first layer for surrounding the corresponding one of said active layer. Said patterned passivation layer of said array of light emitting diodes covers said luminescent chips and said common electrode, and exposed said pixel electrodes and an end of said common electrode. Each of said solder bumps of said array of said light emitting diode connect with corresponding one of said pixel electrode. In this invention, each of said solder bumps of said array of photodiodes is flip chip bonded on the corresponding one of said solder bumps of said array of said light emitting diodes.

聯絡資訊
承辦人姓名	李曉琪
承辦人電話	03-5715131 #31061
承辦人Email	hsiaochi@mx.nthu.edu.tw